The IDS3010 enables to measure displacements in the nanometer range. The modular and miniaturized design of the IDS3010 makes it easy to adapt all three measurement axes to a broad variety of applications. The Fabry Perot principle
enables sensor heads with less components and more stable measurements.

With its compact design, the IDS3010 can be directly integrated into machines and is the best choice for challenging OEM & Semiconapplications. We also offer product customizationto meet your difficult requirements

During the photolithography process circuit patters of few nanometers in size are transferred from the photomask (reticle) via various lenses onto the semiconductor wafer. After the photomask pattern is projected to one part of the wafer, the wafer stage is moved and the lithography process is repeated until the whole wafer is covered with the respective patterns. The ultraprecise position tracking and alignment of measurement frame, optics and wafer stage is key condition to ensure highest quality throughout the lithography process.

attocube´s interferometer sensor IDS3010 with vacuum and high temperature compatible sensor heads can be easily integrated into lithography machines, ensuring the best alignment among the key components with nanometer accuracy, delivering high speed data with up to 10 MHz bandwidth.

With the advancement of EUV (extreme ultraviolet) and electron-beam technologies,nanometer-accurate and reliable positioning of components such as wafers, reticles, beam alignment stages, optics, and mirrors has become increasingly crucial. Achieving nanometer precision in fast and long-range movements necessitates the use of corresponding sensors for closed-loop motion control. These sensors must meet the high standards and requirements of production and quality assurance processes. Challenges include ensuring ultra-high vacuum (UHV) and cleanroom compatibility, withstanding high temperatures, and maintaining the highest accuracy over large travel ranges, especially as wafer sizes increase.

The compact sensor heads of attocube’s modular and fiber based interferometer sensor IDS3010 can be directly integrated into the machine. This enables nano-precise linear and angular measurements, as well as closed-loop control even under extreme conditions such as high & ultra high vacuum. The flexible installation of the sensor heads allows for a 6 DoF analysis and a bandwidth of up to 10 MHz enables ultra-fast stage vibration analysis to achieve ultimate precision during mask inspection.

In thermal gas treatment, harmful gases are broken down at very high temperatures and scrubbed in the downstream wet stage. We have three different thermal systems using different fuel source in our product portfolio.

Product Detail

Burn-Wet Scrubber CT-BW

Fuel source: CH4, Propan, Hydrogen…etc

High destruction and removal efficiency (DRE) – especially for climate-damaging PFCs

Reliable disposal of particles and gaseous by-products

Safe and media-saving operation under challenging process conditions

Thermal-Wet Scrubber CT-TW

Fuel source: electric heater

Reliable disposal of flammable waste gases and gaseous by-products

Lower installation costs (no fuel gas and oxygen required)

Plasma-Wet Scrubber CT-PW

Fuel source: Plasma source

Suitable for waste gas treatment from CVD and etching processes

Reliable disposal of praticle and gaseous by-products

In the wet scrubber, water-soluble harmful substances in the waste gas are washed out and transferred to the liquid phase.

Product Detail

• Suitable for treating waste gases from various applications including etching and EPI processes
• Efficient and cost-effective treatment of HCl, HF, SiH2Cl2, SiCl4 and NH3 along with other acidic and alkaline waste gases

Low operating costs due to minimal fresh water consumption

In the dry bed absorber, harmful gases are converted into non-volatile, inorganic solids that are permanently bound to the granules.

Product Detail

Easy installation and requires only electricity and compressed air or nitrogen for the operation.

Dry bed absorber as a passive system ensures continuous disposal of waste gases even in the event of a power failure.

Granules specifically developed for semiconductor and photovoltaic applications guarantee safe disposal of harmful gases.

PillarHall LHAR4 silicon test chip contains Lateral Ultra High Aspect Ratio test structures (>1000) for ALD and CVD thin film characterization. It is used as a measurement tool for thin film conformality and thin film side wall properties in a deep trench.

The purpose of Chipmetrics’ pocket wafers is to enable the usage of Chipmetrics’ test chips in wafer level processing. At 3D NAND or DRAM foundries, 300 mm wafers are the only working substrates. Pocket wafer with bonded test chips is the solution for wafer level thin film conformality evaluation for such production fabs. The available pocket wafer sizes are 150 mm, 200 mm and 300 mm.

Our FHR.Star vacuum coating systems offer advanced thin-film coating solutions designed to meet the demanding needs of the semiconductor industry. With modular configurations and scalable architecture, this system ensures flexibility and efficiency, making it ideal for R&D and high-volume production.
It supports various deposition processes, including PVD, CVD, and PECVD, enabling precise and uniform coatings essential for semiconductor applications. At SEMICON Taiwan 2024, where innovation and cutting-edge technology are paramount, this system addresses the critical needs of manufacturers looking to enhance their production capabilities with reliable, high-performance coating equipment.
The FHR.Star product family is tailored to industry leaders' requirements to optimize fabrication processes and attain exceptional product quality.

FHR's Inline Vacuum Coating System delivers high-throughput thin-film coating solutions tailored to the needs of the semiconductor and electronics industries.
The system applies uniform and precise coatings to substrates of various sizes. Thus, it is ideal for large-scale production environments. Its modular design integrates multiple deposition techniques such as magnetron sputtering, evaporation, and PECVD ensuring versatility and adaptability to evolving manufacturing requirements.
The inline vacuum coating system is a crucial enabler for companies aiming to boost efficiency, product quality, and production scalability. This system is perfect for manufacturers looking to streamline their operations while maintaining the highest standards of thin-film technology.

FHR provides expert Coating Services using state-of-the-art vacuum technologies to deliver custom thin-film coatings. These services cater to various applications, from prototyping and small-batch production to advanced research.Leveraging sputtering and evaporation processes, FHR ensures precise and consistent coatings that meet the highest industry standards.
Our coating services offer a valuable solution for semiconductor and electronics manufacturers looking to enhance their R&D capabilities without investing in extensive in-house equipment. This service allows companies to explore new materials and technologies, ensuring they stay ahead in the competitive semiconductor market.

consists of housing, table, hydrostatic radial/axial bearings, top in stainless steel, sealing by air blow supported gap seals against entering dirt and exit liquid, with PM-flow controllers for feeding of hydrostatic pockets, water cooled torque motor, and cylinder in spindle, complete assembled and tested,with LION Precision synchronic runout test 0.1µm

consists of spindle case, spindle, hydrostatic radial/axial bearings, spindle hardened or nitrated, sealing by air blow supported gap seals against entering dirt and exit liquid, with PM-flow controllers for feeding of hydrostatic pockets, water cooled torque motor, with rotary joint for central water, complete assembled and tested, including snubber for motor grounding.
with LION Precision synchronic runout test 0.1µm

Sorting, splitting and merging of all types of critical wafers and film frames.

Highly flexible modular EFEM for integration with metrology and process systems.

A fully automated solution, cutting and removing of the ring are integrated into one process step improving productivity in combination with increased performance.

HALCON is a powerful standard machine vision software with HDevelop, which is widely used in the world. It can shorten the software development cycle and save the development cost. It shortens the software development cycle and saves development costs. HALCON's flexible architecture facilitates the rapid development of a wide range of machine vision applications, and has accumulated a wide range of application cases in various industries. Whether it is automated picking and sorting in agriculture and food, 3D vision in automotive and robot arm, quality inspection and identification in logistics and packaging, or surface inspection and defect detection in electronics and semiconductors, HALCON meets the needs of efficient production and quality control, and provides the most advanced and comprehensive 3D vision and deep learning algorithms.

MERLIC is an all-in-one software for quickly building machine vision applications without programming. It combines MVTec's extensive expertise with ease of use, providing reliable and fast performance. Its intuitive interface, easyTouch, ensures efficient workflows, saving time and cost. MERLIC's flexible licensing allows tailored packages to fit specific applications.

The easy way into deep learning with MVTec software begins with labeling training data, a crucial step for any deep learning application. The quality of this labeled data significantly influences the application's performance, accuracy, and robustness. With the Deep Learning Tool, you can easily label your data using an intuitive user interface – no programming knowledge required. This data can be seamlessly integrated into HALCON and MERLIC to perform deep-learning-based tasks such as object detection, classification, semantic and instance segmentation, anomaly detection, and Deep OCR. The Deep Learning Tool provides a fast path to a complete deep learning solution, an intuitive user interface, active support for optimizing trained networks, easy integration into the MVTec portfolio, and full control over your data. This comprehensive approach ensures you have all the tools necessary for a successful deep learning application.

You work in prefabrication at a fixed workstation and have to produce as many welds as possible? Do you attach great importance to short production times and require comprehensive documentation for your welds? Then choose our proven Smart Welder orbital welding power source.

The Smart Welder is an intelligent power source equipped with the latest information and communication technology, ensuring the best welding results, high efficiency and sustainable quality management.

The areas of application for the Smart Welder extend to thin-walled pipeline construction, including semiconductor manufacturing, the food industry, aerospace, pharmaceuticals and chemicals, as well as heat exchanger construction.

New intelligent orbital welding head

The new generation of intelligent orbital welding heads - the OWX welding heads mark a significant advance in orbital welding technology.

The slim and futuristic design, combined with the latest smart features, make the OWX heads a must-have in modern pipeline construction.

The OWX welding head features an ergonomic handle and optimized clamping mechanism for easy operation. It includes a flip cover with a viewing window and LED lighting for precise alignment. The welding head integrates seamlessly into fixtures and has an intuitive operating unit in the handle.

Smart features include a display for selecting favorite programs, progress visualization, a gyro sensor for automatic electrode positioning, and a temperature sensor for monitoring.

The maintenance-friendly design allows quick access to components, with maintenance cycles determined by life cycle data. OWX welding heads are compatible with all Orbitalum power sources, OWS clamping shells, and electrode adapters.

With its removable clamping cartridge, integrated control elements and active cooling, the OW 17 clearly stands out in comparison to conventional systems from the competition. This makes it possible to weld thin tubes like those used in semi-conductor production easily, quickly, reliably and – above all – with high quality.

 

Vacuum plasma is used in the semiconductor industry for many years.

Our potential-free Openair-Plasma® systems for industrial fine cleaning & activation, are the ideal technology to treat highly sensitive electrical components. This in-line capable technology can replace error-prone vacuum chamber processes e.g. in the production of chip packages where pristine surfaces, a high surface energy or specific surface functionalities are critical success factors.

By using forming gas (e.g. N2H2) as the process gas, our REDOX-Tool can remove copper- and tin-oxides to enable cutting-edge processes such as flux-less soldering or thermal compression bonding.

This also means it can replace currently used formic- or citric- acid based processes, which are not only less efficient but also pose a considerable health risk to the operators.

Typical applications are found in the production of copper-based power modules, on bonding pads with solder balls, or to clean and prepare various substrates before processes like sintering, molding or wire-bonding.

The Redox Tool is available in various configurations and provides all the features required by high-end semiconductor manufacturers.

Primelite’s UV-LED Exposure System Advanced Light Engine ONE C (ALE/1C) is a powerful spot light source for driving many high-performance industrial UV exposure tools. Typically these are semi-automated and automated mask aligners for 6″ (150 mm) and 8″ (200 mm) wafers or broadband wafer stepper systems (1X steppers/mini steppers). Featuring UV-LED technology, it outperforms conventional high-pressure mercury discharge lamps with excellent output stability and flexible spectrum control. It also consumes less power, does not generate as much heat, lasts longer, and requires minimal overall maintenance

Primelite embraces the principle of building products to serve as a versatile platform. ALE/1C UV-LED Exposure Systems are no exception – they let you combine up to three UV LEDs in the optical path. In most cases, these are i-line (CWL 365 nm), h-line (CWL 405 nm), and g-line (CWL 436 nm) emitters with illumination power exceeding that of conventional 1-kW mercury discharge lamps.

ALE/2 is a high-performance UV spot light source for large substrate exposure tools requiring perfectly uniform and collimated radiation. These may be 8″ or 12″ mask aligners. Its UV output is strong enough to power even larger setups with square areas up to 400x400mm. Featuring UV-LED technology, the ALE/2 outperforms conventional high-pressure mercury discharge lamps with excellent output stability and flexible spectrum control. It also consumes less power, does not generate as much heat, lasts longer, and requires minimal overall maintenance.

ALE/2 UV-LED Exposure Systems make the most of Primelite’s technology platform for you to combine four feedback-controlled high-power UV LEDs in the optical path. i-line (CWL 365nm) and broadband (CWL 365/405/436nm) configurations are available. In i-line-only processes, the ALE/2 System matches the performance of conventional discharge lamps rated for up to 5KW. For broadband use cases, its illumination power rivals that of 2KW discharge lamps.

Our precision UV-LED light source, the Advanced Light Engine 3 (ALE/3), is a remarkably affordable replacement for discharge lamps in wafer edge exposure, inspection applications and demanding.

UV-curing application.

The ALE/3’s optical output, build size, and control interfaces match or surpass the specifications of popular UV light curing units using conventional 200 W mercury discharge lamps or LED technology at a comparable power output level.

Our ALE/3 LED spot light source is rooted in high-volume automotive manufacturing. Equipment destined for this industry’s assembly lines has to live up to some of the most demanding expectations. Automakers want tools that leave a tiny footprint, are ready for automation, and perform reliably, always. Properties that the semiconductor industry also appreciates, for example in inspection or wafer edge exposure applications.