🤩 We are looking forward to our participation at PCIM, hall 7, booth 169, in early May in Nuremberg, Germany. The live demonstration of our #OpenairPlasma, #PlasmaPlus and #REDOX will be great, especially the inline oxide reduction and nanocoating application to prevent EMC delamination in e.g. power module production. Thanks you U.S. Tech Global for publishing our preview press release and the LinkedIn post. We are very pleased with the growing interest in our #plasma #technology for #surfacetreatment.
Plasmatreat: Plasma Technology in Action: See Plasmatreat at PCIM Europe, Booth 7.169 STEINHAGEN, GERMANY — Power modules are at the heart of many modern power electronics applications, from e-mobility and renewable energy to industrial automation and medical technology. Their production places high demands on material quality, reliability and long-term stability. At PCIM Europe 2025 in Nuremberg, May 6-8, Plasmatreat GmbH will demonstrate how Openair-Plasma®, PlasmaPlus® and the new REDOX application solve key challenges in power module production—even under cleanroom conditions. At Plasmatreat's booth 169 in hall 7, the focus will be on automated and inline oxide reduction and plasma coating to prevent EMC delamination in the overmolding process. Challenges for Power Modules: Robust, Compact, Reliable—but Extremely Demanding Modern power modules perform key functions in power electronics, whether in e-mobility, renewable energy, industrial drives or medical technology. They must be able to withstand high voltages and currents for years, while at the same time being compact and highly reliable. In practice, this means transition temperatures of more than 175 °C, electrical voltages in the kilovolt range and power throughputs of several hundred kilowatts. In addition, there are complex requirements for the material connections within the modules - especially at the so-called "triple points", where different materials such as copper, ceramics and sealing compounds come together. This is where stresses, air inclusions, or adhesion problems often occur, which can significantly reduce the lifetime of the modules. Particularly critical is the formation of oxide layers on copper surfaces, resulting in increased contact resistance or poor solderability. Delamination of epoxy resins in the injection molding process is also a known risk that promotes mechanical failure. To meet these challenges, stable, process-reliable joining technologies and targeted surface treatment are essential. Innovative Solutions with Openair-Plasma® and PlasmaPlus® - live at PCIM Europe With its atmospheric pressure plasma solutions, Plasmatreat offers powerful technologies for surface modification that effectively address the weak points just mentioned with a combination of Openair-Plasma®, PlasmaPlus® and the new REDOX technology. The dry, chemical-free and VOC-free plasma solutions can be easily integrated in-line with existing production processes for reliable pretreatment, improved adhesion and durable electrical and mechanical joints. Plasmatreat's systems and equipment are clean room compatible and meet the requirements of the electronics industry. Oxide layer reduction with the innovative REDOX tool enables selective inline plasma treatment to remove oxide films from metallic surfaces without the use of flux. This optimizes electrical conductivity and significantly… http://dlvr.it/TK3cKw