mechatronic systemtechnik

👉 Introducing the mechatronic wafer loader NEO (mWL NEO)   Built on the proven foundation of the original mWL, the NEO version takes wafer loading to the next level with a smarter, more compact, and even more flexible design. It is tailored for 200 mm and 300 mm wafers, supporting everything from FOUPs to open cassettes, all in a sleek, cleanroom-optimized form.   -Ultra compact footprint for maximum space efficiency -Compatible with FOUPs, open cassettes, trays and custom tool layouts -Supports advanced end-effectors and precise wafer alignment -Cleanroom friendly build with smooth surfaces and hidden cable routing -Full SECS GEM communication for fab-wide integration   The mWL NEO is ideal for both R&D environments and high-volume production, combining speed, cleanliness and configurability in one streamlined solution.   🔎 Want to know more? 🌐 Visit our website: www.mechatronic.at   #mechatronicsystemtechnik #SemiconductorIndustry #WaferHandling #AdvancedPackaging #SemiconductorEquipment #AutomationTechnology #HighTechManufacturing

Only One Week Before Taiwan SEMICON - Are You Ready?   From Sept. 10–12, 2025, mechatronic systemtechnik gmbh will be at SEMICON Taiwan.   📍 Visit us at Booth #J2754 and learn more about our automated handling systems for non-standard substrates and non-standard handling requirements, including thin, warped, MEMS, glass, Taiko, panel, and frame solutions!   Modularity, Versatility, and Flexibility - All on One Platform   Your innovation starts here , see you at Booth #J2754 #semiconductor #SemiTaiwan #electronicsmanufacturing #electronicsdesign #technology #innovation #engineering #TaiwanSemicon

⏰ Only 2 weeks to go! Save the Date! From Sept. 10–12, 2025, mechatronic systemtechnik gmbh will be at SEMICON Taiwan. 📍 Visit us at Booth #J2754 and explore our automated handling systems for non-standard substrates and unique handling requirements-including thin, warped, MEMS, glass, Taiko, panel, and frame solutions! Modularity, Versatility, and Flexibility — All on One Platform 🌟 We’re counting down the days and can’t wait to meet you in Taipei - see you soon! #semiconductor #SemiTaiwan #electronicsmanufacturing #electronicsdesign #technology #innovation #engineering #TaiwanSemicon

Save the Date! From Sept. 10-12, 2025, mechatronic systemtechnik gmbh will be at SEMICON Taiwan. 📍 Visit us at Booth #J2754 and learn more about our automated handling systems for non-standard substrates and non-standard handling requirements—including thin, warped, MEMS, glass, Taiko, panel, and frame solutions! Modularity, Versatility, and Flexibility — All on One Platform 🌟 Stay tuned for more updates — we look forward to seeing you there! #semiconductor #SemiTaiwan #electronicsmanufacturing #electronicsdesign #technology #innovation #engineering

Working as a software developer at mechatronic systemtechnik has been a rewarding experience. With 8 years of experience in this role, I’ve had the chance to grow alongside the company. The company offers an innovative and inspiring work environment where teamwork and personal development are highly valued. The dynamic and fast-paced work style, with frequent last-minute changes, presents an exciting challenge,as it requires flexibility and quick adaptability. It’s exactly these challenges that make the work so diverse and engaging. I particularly enjoy the opportunity to work on cutting-edge technologies and contribute to the continuous optimization of our systems. mechatronic combines technological excellence with a dynamic company culture, allowing me to grow both professionally and personally I look forward to continuing to innovate and contribute to mechatronic’s success in the years to come #mechatronicsystemtechnik #SemiconductorIndustry #WaferHandling #AdvancedPackaging #SemiconductorEquipment #AutomationTechnology #HighTechManufacturing #software

Introducing the mechatronic wafer sorter (mWS) Streamline your wafer flow with a fully automated solution for sorting, splitting, merging, and transferring wafers,  from 150 mm to 300 mm including challenging types like thin, warped, Taiko, glass, and MEMS wafers. Configuration and design optimized to customer wafer characteristics and handling requirements Automated change of end effector for ideal handling conditions for critical wafers Lowest contamination, wafer breakage and maximized yield Maximum uptime and availability by lowest maintenance effort Makro inspection capabilities 🔎 Want to know more? 👉Product details: https://lnkd.in/d-BZQV3q 🌐 Visit our website: www.mechatronic.at #mechatronicsystemtechnik #SemiconductorIndustry #WaferHandling #AdvancedPackaging #SemiconductorEquipment #AutomationTechnology #HighTechManufacturing

🎯 The wafer doesn’t care where the error happened. It just fails. In every fab, yield loss hurts and everyone feels it: • Engineers scramble to trace root cause • Production slows down • Customers ask tough questions • Margins disappear But here’s the truth no one likes to say out loud: ⚠️ A lot of those failures don’t come from deposition or etch. They come from handling. - From cracked edges - From particle contamination - From poor vacuum contact - From misalignment in transfer 💡 Wafer handling doesn’t get much attention - until something breaks. At mechatronic systemtechnik, we focus on the part of the process that doesn’t make headlines - but quietly protects your entire flow. Because the wafer? It doesn’t care where the error happened. It just fails. 🔍 Where does yield loss start in your process? Let’s talk about how to stop it before it starts. #YieldMatters #WaferHandling #FabLife #CleanroomAutomation #SemiconductorManufacturing #MEMS #GlassWafers #AdvancedPackaging

🚚 It’s Not the Process That Breaks the Wafer It’s the Transfer. In modern fabs, process steps are often highly controlled - deposition, etch, litho, bonding. But in between these steps, something critical happens: ➡️ The wafer has to move. And that’s where risk lives. ⚠️ Common damage scenarios: • Misaligned vacuum chucks during pick & place • Edge contact during FOUP loading • Tape peel stress during transfer • Vibration damage during tool handoff 📉 These aren’t process errors. They’re handling errors - and they silently hurt yield, especially on: • Ultra-thin wafers • Taped/glass substrates • Bowed or warped wafers • Bonded stacks or compound materials 🛠️ At mechatronic systemtechnik, we design tools that help reduce that risk - by making handling precision a priority, not an afterthought. Because between every major process step… is a moment where the wafer is most vulnerable. 🔍 Are your handling systems helping - or hurting-your yield? #WaferHandling #YieldEngineering #SemiconductorAutomation #CleanroomTools #AdvancedPackaging #MEMS #NonStandardWafers #FabEfficiency

🧊 The Most Critical Part of Semiconductor Manufacturing? You Can’t Even See It. When we talk about innovation in semiconductors, we often hear about: • Smaller nodes • New materials • Heterogeneous integration • Chiplets and packaging breakthroughs But one part rarely gets the spotlight - yet without it, none of that would be possible: 🎯 Wafer handling. Not flashy. But absolutely mission-critical. Every fragile wafer - whether glass, compound, taped, or bonded - has to move through dozens of steps without a scratch, particle, misalignment, or break. ⚠️ A single mishandling moment can destroy: • Process stability • Final device yield • Cycle time and throughput • Tool availability and uptime 💡 At mechatronic systemtechnik, we work with customers where precision handling isn’t just support - it’s a strategic function. Because what protects your wafers… protects your yield. 📌 Is your handling strategy keeping pace with your materials? #WaferHandling #SemiconductorAutomation #YieldEngineering #MEMS #AdvancedPackaging #FabTechnology #GlassWafers #CleanroomAutomation

Introducing the mechatronic wafer packer (mPT) Boost your wafer logistics with fully automated, stress-free packing and unpacking-no manual handling inside the machine. Compatible with 150/200 mm or 200/300 mm carriers, FOUPs, FOSBs, and shipping boxes.   -Unique modules and components (end effectors, pre-aligners, chucks, scanners) enable to handling of multiple types of substrates and multiple types of packing material in one system including Taiko rings without hardware change -Highest reliability, safety as well as reduced stress, and contamination to wafers due to advanced sensing capabilities -High throughput (up to 150 wafers/hour) -Sorting functions are available in combination with WID reading Whether you're managing standard or non‑standard substrates like warped or Taiko wafers, the mPT packs and unpacks with maximum uptime and minimum effort.   🔎 Want to know more? 👉Product details: https://bit.ly/403lili 🌐 Visit our website: www.mechatronic.at #mechatronicsystemtechnik #SemiconductorIndustry #ServiceEngineer #SoftwareEngineer #WaferHandling