mechatronic systemtechnik reposted this
🌀 Thin Wafers: When Less Isn’t Always More As the industry pushes toward thinner devices and stacked architectures, thin wafers are becoming the norm, especially in power devices, memory, and 3D integration. But thinner means riskier. Handling these wafers is like carrying eggshells through a factory line. 🥚💥 📏 Typical specs: • Thickness <150 µm - sometimes down to 50 µm! • Often temporarily bonded to carriers • Post-process warpage is common ⚠️ What makes thin wafers tricky: • 🪞 Flexibility = breakage if mishandled • 🌪️ Vacuum chuck can cause deformation • ⚖️ De-bonding steps introduce stress • 🔍 Optical inspection gets complicated on thin, warped wafers 🛠️ What leading fabs do: • Use edge-grip or edge-contact handling • Combine UV-tape with controlled de-bond processes • Integrate adaptive chuck pressure and active warpage compensation • Focus on gentle automation - low-force, high-precision 💡 At mechatronic systemtechnik, we’ve supported many customers with automation designed for fragile and exotic wafers, where yield depends on every micron of precision. 🔁 Are you seeing more thin wafer requirements in your processes? Let’s connect and discuss how handling can make or break the final yield. #ThinWafers #3DIC #AdvancedPackaging #SemiconductorHandling #YieldEngineering #MEMS #WaferBonding #CleanroomAutomation #SemiconductorEngineering #GlassWafers #YieldManagement #WaferHandling