mechatronic systemtechnik

🌀 Thin Wafers: When Less Isn’t Always More As the industry pushes toward thinner devices and stacked architectures, thin wafers are becoming the norm, especially in power devices, memory, and 3D integration. But thinner means riskier. Handling these wafers is like carrying eggshells through a factory line. 🥚💥 📏 Typical specs: • Thickness <150 µm - sometimes down to 50 µm! • Often temporarily bonded to carriers • Post-process warpage is common ⚠️ What makes thin wafers tricky: • 🪞 Flexibility = breakage if mishandled • 🌪️ Vacuum chuck can cause deformation • ⚖️ De-bonding steps introduce stress • 🔍 Optical inspection gets complicated on thin, warped wafers 🛠️ What leading fabs do: • Use edge-grip or edge-contact handling • Combine UV-tape with controlled de-bond processes • Integrate adaptive chuck pressure and active warpage compensation • Focus on gentle automation - low-force, high-precision 💡 At mechatronic systemtechnik, we’ve supported many customers with automation designed for fragile and exotic wafers, where yield depends on every micron of precision. 🔁 Are you seeing more thin wafer requirements in your processes? Let’s connect and discuss how handling can make or break the final yield. #ThinWafers #3DIC #AdvancedPackaging #SemiconductorHandling #YieldEngineering #MEMS #WaferBonding #CleanroomAutomation #SemiconductorEngineering #GlassWafers #YieldManagement #WaferHandling

Wir suchen eine/n Mitarbeiter Software Dokumentation und Testing (m/w/d) 📍 Standort: Fürnitz | Vollzeit 👉 Jetzt bewerben: https://lnkd.in/dtvuhcn3 🔗 Mehr über uns: www.mechatronic.at ➡️ Qualifikationen & Anforderungen -Laufende oder Abgeschlossene technische Ausbildung (HTL/ FH/ TU) -Organisierte, selbstständige und zielorientierte Arbeitsweise -Erfahrungen mit Dokumentationssystemen von Vorteil -Sicherer Umgang mit dem Computer und unterschiedlichen Desktop-Anwendungen -Gute Deutsch- und Englischkenntnisse in Wort und Schrift ➡️ Aufgaben & Verantwortlichkeiten -Erstellung und Pflege von Bedienungsanleitungen und Verfahrensanweisungen -Pflege und Verwaltung von Datenbeständen -Ausführung von Tests und Generierung von relevanten Testdaten -Qualitätssicherung durch automatische Tests in unserem wachsenden Testframework Interesse an einer spannenden Herausforderung in einem Hightech-Unternehmen? Dann freuen wir uns auf Ihre Bewerbung! #TechnicalSupport #SoftwareDokumentation #JobsFürnitz #Mechatronik #Stellenangebot #Karriere

🔎 Wir suchen eine/n erfahrene/n C#-Softwareentwickler (m/w/d) 📍 Standort: Fürnitz | Vollzeit 👉 Jetzt bewerben: https://lnkd.in/duGTdabi 🔗 Mehr über uns: www.mechatronic.at ➡️ Qualifikationen & Anforderungen -Abgeschlossene technische Ausbildung (HTL/ FH/ TU) -Sehr gute Kenntnisse in der objektorientierten Programmierung (vorzugsweise C#), asynchroner Programmierung, Programmierung verteilter Systeme -Kenntnisse über Softwarearchitekturen -Praktische Erfahrung in der Entwicklung von Desktop-Anwendungen -Deutsch- und Englischkenntnisse in Wort und Schrift -Selbstständige und systematische Arbeitsweise sowie hohe Kommunikations- und Teamfähigkeit ➡️ Aufgaben & Verantwortlichkeiten -Neuentwicklung und Erweiterung von Softwarelösungen für hochmoderne Maschinen in der Halbleiter-Industrie -Design, Implementierung und Testen von wiederverwendbaren Software-Komponenten (Backend / GUI) -Umsetzung von Kunden Anpassungen und Implementierung neuer Kunden Schnittstellen -Qualitätssicherung durch automatische Tests in unserem wachsenden Testframework Interesse an einer spannenden Herausforderung in einem Hightech-Unternehmen? Dann freuen wir uns auf Ihre Bewerbung! #TechnicalSupport #Softwareentwickler #JobsFürnitz #Mechatronik #Stellenangebot #Karriere

🔍 Why are Taiko wafers so challenging to handle in semiconductor manufacturing? Taiko wafers are partially back-thinned substrates with a thicker edge — enabling mechanical stability while keeping the central area ultra-thin for processing. But that edge design brings serious automation challenges: 🌀 Ultra-Thin Center, Thick Edge High risk of cracking or warping during handling or vacuum transfer. 🎯 Edge Handling Required Conventional tools can’t grip or support the edge safely — precision is a must. 💨 Vacuum Handling Limitations Vacuum force must be carefully distributed to avoid damage to the thinned area. 🔄 Ring Removal & Frame Detachment Post-process steps like laser cut ring removal need gentle yet accurate separation. ⚠️ Process Fragility in Backend Even minor misalignment can cause catastrophic breakage in backend operations. 🤝 What’s your experience with Taiko wafer automation? Do you rely more on edge-gripping, vacuum, or hybrid handling strategies? Let’s share practical insights — because the backend deserves smart automation too. #Semiconductor #TaikoWafer #WaferHandling #MEMS #AdvancedPackaging #NonStandardWafers #BackendAutomation #CleanroomEngineering #PrecisionAutomation

🧠 MEMS Wafers: Small Devices, Big Handling Problems MEMS wafers might look like any other, but their internal structures are anything but ordinary. They’re delicate, high-value, and often a nightmare to handle in automation setups 👇 🔬 Why MEMS wafers are special: • Feature ultra-small moving structures (cantilevers, mirrors, sensors) • Use non-standard materials like SOI, glass, or even polymers • Often have etched cavities, trenches, or voids ⚠️ Common handling risks: • Microstructures can break from vibration or contact • Wafer bow and stress due to complex layering • Non-uniform surface makes vacuum holding tricky • Risk of particle contamination = functional failure 🛠 What fabs and toolmakers do: • Use edge-contact handling to avoid surface touch • Apply tape/substrate carriers during processing • Incorporate vibration-damping modules in tools • Rely on fully automated, low-force transfer systems 💡 At mechatronic systemtechnik, we support MEMS customers to meet their unique requirements — and we’ve learned: MEMS wafers demand more than just precision… they need empathy from your automation. 💬 Have you handled MEMS wafers in your process line or tool design? What worked — and what didn’t? #MEMS #WaferHandling #SemiconductorEngineering #SOIWafers #CleanroomAutomation #ProcessIntegration #AdvancedPackaging #FabEquipment #YieldManagement #Photonics #GlassWafers

In semiconductor backend, the complexity isn’t going away. Instead of uniform silicon, we now face: 🔹 Compound substrates like SiC, GaN 🔹 Warped, ultra-thin, or double-sided wafers 🔹 Glass, Taiko, and MEMS-specific formats This shift is putting enormous pressure on automation systems — especially in the backend, where handling is no longer just “transport,” but a core enabler of yield and reliability. At mechatronic systemtechnik, we’re not just observing this shift — we’re in the middle of it. Working closely with global fabs and OSATs, we support them in automating flexibility across frames, wafers, and panels — especially where other tools would struggle. Advanced substrate handling isn’t niche anymore. It’s becoming the backbone of modern semiconductor manufacturing. #SemiconductorIndustry #AdvancedPackaging #WaferHandling #PowerSemiconductors #MEMS #SiC #CleanroomAutomation

🔍 Glass Wafers: Not Just for Displays Anymore Glass is stepping into the spotlight — not just in photonics and displays, but in advanced packaging and MEMS too. Yet handling glass wafers brings unique headaches that fabs can’t ignore 👇 🧪 Why glass wafers? • Excellent optical clarity • High thermal and chemical stability • Electrical insulation properties • Perfect for photonics, interposers, and certain sensor applications ⚠️ Handling challenges: • ⚠️ Fragile and easy to chip • 💨 Difficult to vacuum due to low porosity • 🔍 Transparent — makes alignment & inspection tougher • 🌀 Warpage or bow issues post-processing 🛠️ Solutions fabs use: • Special vacuum chucks with controlled flow • UV-tape or carrier-based handling • Optical alignment systems • Edge-support tools to avoid microcracks 💡 At mechatronic systemtechnik we’ve encountered these pain points regularly — and seen how automation must adapt to the transparency and fragility of glass substrates. 💬 Do you see glass wafers becoming a key player in advanced packaging or MEMS? How is your line adapting to non-silicon materials? #GlassWafers #SemiconductorEngineering #AdvancedPackaging #WaferHandling #MEMS #Photonics #CleanroomAutomation #YieldManagement

⚠️ Ultra-Thin Wafers: Engineering Precision to Avoid Breakage In advanced semiconductor manufacturing, thinner wafers mean better performance — but also higher fragility. Let’s look at what makes ultra-thin wafer handling such a delicate art 👇 🧊 What’s an ultra-thin wafer? Wafers thinned below 100 µm — often down to 30–50 µm — used in 3D packaging, power devices, or mobile chips. 🔍 The core challenge: • Brittle and prone to cracking • Difficult to vacuum-chuck or grip • High risk of edge or backside damage 🛠 Handling strategies we often see in fabs: • Edge-grip end effectors with soft materials • Temporary bonding and debonding techniques • Ultra-low-pressure vacuum chucks • Controlled atmosphere transport boxes 💡 At mechatronic systemtechnik, we regularly explore these challenges with customers handling fragile or non-standard substrates. The engineering complexity behind ultra-thin wafers continues to push the boundaries of automation and precision. 💬 Have you worked with ultra-thin wafers? What’s been your biggest challenge — or best solution? #UltraThinWafers #WaferHandling #SemiconductorEngineering #3DIC #AdvancedPackaging #MEMS #YieldManagement #CleanroomAutomation #WaferLevelPackaging #SemiconductorManufacturing

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