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mechatronic systemtechnik

mechatronic systemtechnik

Semiconductor Manufacturing

Fürnitz, Carinthia 1,112 followers

We can handle it

About us

mechatronic systemtechnik, headquartered in Villach, Austria, is a leading global supplier of automation equipment for semiconductor wafer handling. Since our inception in 1998, we’ve specialized in addressing the industry’s needs for reliable, safe, and fully-automated handling of non-standard substrates — including thin, warped, and other critical wafers such as ultrathin, MEMS, eWLP, TAIKO, bumped, and film frames. Our proprietary technology and modular approach enable us to offer IDMs and fabs a cost-efficient solution for complex wafer handling requirements. mechatronic systemtechnik is a subsidiary of Accuron Industrial Technologies. For more information, please visit www.accuronindustrial.com

Website
http://www.mechatronic.at
Industry
Semiconductor Manufacturing
Company size
51-200 employees
Headquarters
Fürnitz, Carinthia
Type
Privately Held
Founded
1998
Specialties
Non-standard substrates, Non-standard handling requirements, Special handling requirement, Automated Wafer handling, Wafer handling systems, Wafer handler, Wafer sorter, Wafer sorting, Wafer packer, Calotte loader, TAIKO ring remover, eWLP, Thin wafer, Warped wafer, Critical wafer, Ultrathin wafer, Wafer support ring, EFEM, Atmospheric transport module, and TAIKO

Locations

Employees at mechatronic systemtechnik

Updates

  • mechatronic systemtechnik reposted this

    View profile for Sanel Muslimovic

    Key Account Manager at mechatronic systemtechnik Customer Satisfaction & Relationship Management | Full-Cycle Sales & New Business Development | Customer Success & Strategic Growth | mechatronics & High-Tech Solutions

    🌀 Thin Wafers: When Less Isn’t Always More As the industry pushes toward thinner devices and stacked architectures, thin wafers are becoming the norm, especially in power devices, memory, and 3D integration. But thinner means riskier. Handling these wafers is like carrying eggshells through a factory line. 🥚💥 📏 Typical specs: • Thickness <150 µm - sometimes down to 50 µm! • Often temporarily bonded to carriers • Post-process warpage is common ⚠️ What makes thin wafers tricky: • 🪞 Flexibility = breakage if mishandled • 🌪️ Vacuum chuck can cause deformation • ⚖️ De-bonding steps introduce stress • 🔍 Optical inspection gets complicated on thin, warped wafers 🛠️ What leading fabs do: • Use edge-grip or edge-contact handling • Combine UV-tape with controlled de-bond processes • Integrate adaptive chuck pressure and active warpage compensation • Focus on gentle automation - low-force, high-precision 💡 At mechatronic systemtechnik, we’ve supported many customers with automation designed for fragile and exotic wafers, where yield depends on every micron of precision. 🔁 Are you seeing more thin wafer requirements in your processes? Let’s connect and discuss how handling can make or break the final yield. #ThinWafers #3DIC #AdvancedPackaging #SemiconductorHandling #YieldEngineering #MEMS #WaferBonding #CleanroomAutomation #SemiconductorEngineering #GlassWafers #YieldManagement #WaferHandling

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  • Wir suchen eine/n Mitarbeiter Software Dokumentation und Testing (m/w/d) 📍 Standort: Fürnitz | Vollzeit 👉 Jetzt bewerben: https://lnkd.in/dtvuhcn3 🔗 Mehr über uns: www.mechatronic.at ➡️ Qualifikationen & Anforderungen -Laufende oder Abgeschlossene technische Ausbildung (HTL/ FH/ TU) -Organisierte, selbstständige und zielorientierte Arbeitsweise -Erfahrungen mit Dokumentationssystemen von Vorteil -Sicherer Umgang mit dem Computer und unterschiedlichen Desktop-Anwendungen -Gute Deutsch- und Englischkenntnisse in Wort und Schrift ➡️ Aufgaben & Verantwortlichkeiten -Erstellung und Pflege von Bedienungsanleitungen und Verfahrensanweisungen -Pflege und Verwaltung von Datenbeständen -Ausführung von Tests und Generierung von relevanten Testdaten -Qualitätssicherung durch automatische Tests in unserem wachsenden Testframework Interesse an einer spannenden Herausforderung in einem Hightech-Unternehmen? Dann freuen wir uns auf Ihre Bewerbung! #TechnicalSupport #SoftwareDokumentation #JobsFürnitz #Mechatronik #Stellenangebot #Karriere

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  • 🔎 Wir suchen eine/n erfahrene/n C#-Softwareentwickler (m/w/d) 📍 Standort: Fürnitz | Vollzeit 👉 Jetzt bewerben: https://lnkd.in/duGTdabi 🔗 Mehr über uns: www.mechatronic.at ➡️ Qualifikationen & Anforderungen -Abgeschlossene technische Ausbildung (HTL/ FH/ TU) -Sehr gute Kenntnisse in der objektorientierten Programmierung (vorzugsweise C#), asynchroner Programmierung, Programmierung verteilter Systeme -Kenntnisse über Softwarearchitekturen -Praktische Erfahrung in der Entwicklung von Desktop-Anwendungen -Deutsch- und Englischkenntnisse in Wort und Schrift -Selbstständige und systematische Arbeitsweise sowie hohe Kommunikations- und Teamfähigkeit ➡️ Aufgaben & Verantwortlichkeiten -Neuentwicklung und Erweiterung von Softwarelösungen für hochmoderne Maschinen in der Halbleiter-Industrie -Design, Implementierung und Testen von wiederverwendbaren Software-Komponenten (Backend / GUI) -Umsetzung von Kunden Anpassungen und Implementierung neuer Kunden Schnittstellen -Qualitätssicherung durch automatische Tests in unserem wachsenden Testframework Interesse an einer spannenden Herausforderung in einem Hightech-Unternehmen? Dann freuen wir uns auf Ihre Bewerbung! #TechnicalSupport #Softwareentwickler #JobsFürnitz #Mechatronik #Stellenangebot #Karriere

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  • mechatronic systemtechnik reposted this

    View profile for Sanel Muslimovic

    Key Account Manager at mechatronic systemtechnik Customer Satisfaction & Relationship Management | Full-Cycle Sales & New Business Development | Customer Success & Strategic Growth | mechatronics & High-Tech Solutions

    🔍 Why are Taiko wafers so challenging to handle in semiconductor manufacturing? Taiko wafers are partially back-thinned substrates with a thicker edge — enabling mechanical stability while keeping the central area ultra-thin for processing. But that edge design brings serious automation challenges: 🌀 Ultra-Thin Center, Thick Edge High risk of cracking or warping during handling or vacuum transfer. 🎯 Edge Handling Required Conventional tools can’t grip or support the edge safely — precision is a must. 💨 Vacuum Handling Limitations Vacuum force must be carefully distributed to avoid damage to the thinned area. 🔄 Ring Removal & Frame Detachment Post-process steps like laser cut ring removal need gentle yet accurate separation. ⚠️ Process Fragility in Backend Even minor misalignment can cause catastrophic breakage in backend operations. 🤝 What’s your experience with Taiko wafer automation? Do you rely more on edge-gripping, vacuum, or hybrid handling strategies? Let’s share practical insights — because the backend deserves smart automation too. #Semiconductor #TaikoWafer #WaferHandling #MEMS #AdvancedPackaging #NonStandardWafers #BackendAutomation #CleanroomEngineering #PrecisionAutomation

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  • mechatronic systemtechnik reposted this

    View profile for Sanel Muslimovic

    Key Account Manager at mechatronic systemtechnik Customer Satisfaction & Relationship Management | Full-Cycle Sales & New Business Development | Customer Success & Strategic Growth | mechatronics & High-Tech Solutions

    🧠 MEMS Wafers: Small Devices, Big Handling Problems MEMS wafers might look like any other, but their internal structures are anything but ordinary. They’re delicate, high-value, and often a nightmare to handle in automation setups 👇 🔬 Why MEMS wafers are special: • Feature ultra-small moving structures (cantilevers, mirrors, sensors) • Use non-standard materials like SOI, glass, or even polymers • Often have etched cavities, trenches, or voids ⚠️ Common handling risks: • Microstructures can break from vibration or contact • Wafer bow and stress due to complex layering • Non-uniform surface makes vacuum holding tricky • Risk of particle contamination = functional failure 🛠 What fabs and toolmakers do: • Use edge-contact handling to avoid surface touch • Apply tape/substrate carriers during processing • Incorporate vibration-damping modules in tools • Rely on fully automated, low-force transfer systems 💡 At mechatronic systemtechnik, we support MEMS customers to meet their unique requirements — and we’ve learned: MEMS wafers demand more than just precision… they need empathy from your automation. 💬 Have you handled MEMS wafers in your process line or tool design? What worked — and what didn’t? #MEMS #WaferHandling #SemiconductorEngineering #SOIWafers #CleanroomAutomation #ProcessIntegration #AdvancedPackaging #FabEquipment #YieldManagement #Photonics #GlassWafers

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  • mechatronic systemtechnik reposted this

    View profile for Sanel Muslimovic

    Key Account Manager at mechatronic systemtechnik Customer Satisfaction & Relationship Management | Full-Cycle Sales & New Business Development | Customer Success & Strategic Growth | mechatronics & High-Tech Solutions

    In semiconductor backend, the complexity isn’t going away. Instead of uniform silicon, we now face: 🔹 Compound substrates like SiC, GaN 🔹 Warped, ultra-thin, or double-sided wafers 🔹 Glass, Taiko, and MEMS-specific formats This shift is putting enormous pressure on automation systems — especially in the backend, where handling is no longer just “transport,” but a core enabler of yield and reliability. At mechatronic systemtechnik, we’re not just observing this shift — we’re in the middle of it. Working closely with global fabs and OSATs, we support them in automating flexibility across frames, wafers, and panels — especially where other tools would struggle. Advanced substrate handling isn’t niche anymore. It’s becoming the backbone of modern semiconductor manufacturing. #SemiconductorIndustry #AdvancedPackaging #WaferHandling #PowerSemiconductors #MEMS #SiC #CleanroomAutomation

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  • mechatronic systemtechnik reposted this

    View profile for Sanel Muslimovic

    Key Account Manager at mechatronic systemtechnik Customer Satisfaction & Relationship Management | Full-Cycle Sales & New Business Development | Customer Success & Strategic Growth | mechatronics & High-Tech Solutions

    🔍 Glass Wafers: Not Just for Displays Anymore Glass is stepping into the spotlight — not just in photonics and displays, but in advanced packaging and MEMS too. Yet handling glass wafers brings unique headaches that fabs can’t ignore 👇 🧪 Why glass wafers? • Excellent optical clarity • High thermal and chemical stability • Electrical insulation properties • Perfect for photonics, interposers, and certain sensor applications ⚠️ Handling challenges: • ⚠️ Fragile and easy to chip • 💨 Difficult to vacuum due to low porosity • 🔍 Transparent — makes alignment & inspection tougher • 🌀 Warpage or bow issues post-processing 🛠️ Solutions fabs use: • Special vacuum chucks with controlled flow • UV-tape or carrier-based handling • Optical alignment systems • Edge-support tools to avoid microcracks 💡 At mechatronic systemtechnik we’ve encountered these pain points regularly — and seen how automation must adapt to the transparency and fragility of glass substrates. 💬 Do you see glass wafers becoming a key player in advanced packaging or MEMS? How is your line adapting to non-silicon materials? #GlassWafers #SemiconductorEngineering #AdvancedPackaging #WaferHandling #MEMS #Photonics #CleanroomAutomation #YieldManagement

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  • mechatronic systemtechnik reposted this

    View profile for Sanel Muslimovic

    Key Account Manager at mechatronic systemtechnik Customer Satisfaction & Relationship Management | Full-Cycle Sales & New Business Development | Customer Success & Strategic Growth | mechatronics & High-Tech Solutions

    ⚠️ Ultra-Thin Wafers: Engineering Precision to Avoid Breakage In advanced semiconductor manufacturing, thinner wafers mean better performance — but also higher fragility. Let’s look at what makes ultra-thin wafer handling such a delicate art 👇 🧊 What’s an ultra-thin wafer? Wafers thinned below 100 µm — often down to 30–50 µm — used in 3D packaging, power devices, or mobile chips. 🔍 The core challenge: • Brittle and prone to cracking • Difficult to vacuum-chuck or grip • High risk of edge or backside damage 🛠 Handling strategies we often see in fabs: • Edge-grip end effectors with soft materials • Temporary bonding and debonding techniques • Ultra-low-pressure vacuum chucks • Controlled atmosphere transport boxes 💡 At mechatronic systemtechnik, we regularly explore these challenges with customers handling fragile or non-standard substrates. The engineering complexity behind ultra-thin wafers continues to push the boundaries of automation and precision. 💬 Have you worked with ultra-thin wafers? What’s been your biggest challenge — or best solution? #UltraThinWafers #WaferHandling #SemiconductorEngineering #3DIC #AdvancedPackaging #MEMS #YieldManagement #CleanroomAutomation #WaferLevelPackaging #SemiconductorManufacturing

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Funding

mechatronic systemtechnik 3 total rounds

Last Round

Series unknown

US$ 412.6K

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