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Key Account Manager at mechatronic systemtechnik Customer Satisfaction & Relationship Management | Full-Cycle Sales & New Business Development | Customer Success & Strategic Growth | mechatronics & High-Tech Solutions
🚚 It’s Not the Process That Breaks the Wafer It’s the Transfer. In modern fabs, process steps are often highly controlled - deposition, etch, litho, bonding. But in between these steps, something critical happens: ➡️ The wafer has to move. And that’s where risk lives. ⚠️ Common damage scenarios: • Misaligned vacuum chucks during pick & place • Edge contact during FOUP loading • Tape peel stress during transfer • Vibration damage during tool handoff 📉 These aren’t process errors. They’re handling errors - and they silently hurt yield, especially on: • Ultra-thin wafers • Taped/glass substrates • Bowed or warped wafers • Bonded stacks or compound materials 🛠️ At mechatronic systemtechnik, we design tools that help reduce that risk - by making handling precision a priority, not an afterthought. Because between every major process step… is a moment where the wafer is most vulnerable. 🔍 Are your handling systems helping - or hurting-your yield? #WaferHandling #YieldEngineering #SemiconductorAutomation #CleanroomTools #AdvancedPackaging #MEMS #NonStandardWafers #FabEfficiency