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⚙️ The Rise of Custom Automation in Semiconductor Fabs Standard tools work well - until your wafer doesn’t follow the standard. More fabs today are processing: • Glass or transparent substrates • Ultra-thin or warped wafers • Taped, bonded, or carrier-mounted types • Materials beyond traditional silicon 💡 And suddenly, standard automation starts to fall short: • Vacuum systems lose grip • Alignment becomes unstable • Wafer breakage increases • Throughput drops from manual handling workarounds 🔍 That’s why many fabs now explore customized handling solutions - tuned to their unique material flows and yield risks. At mechatronic systemtechnik, we’ve supported customers where: ✅ Handling requirements went beyond standard tools ✅ Materials or formats required more adaptable solutions ✅ Wafer integrity and precision were non-negotiable Our role: Deliver wafer handling tools that can adapt - when off-the-shelf just isn’t enough. We understand that every fab has its own challenges. And in today’s fast-moving landscape, having the flexibility to support that-is often the real competitive edge. 🔄 How is your fab preparing for the shift toward more diverse substrate handling? #WaferHandling #CleanroomAutomation #SemiconductorTools #AdvancedPackaging #MEMS #ThinWafers #GlassWafers #ProcessAdaptation